Designing RF Subsystems for today’s wireless portable products requires balancing packaging choices to meet demanding customer targets of cost, size and performance. Packaging choices range from standard single die packages to System-in-Package (SiP). Cost, size and RF performance are strongly influenced by device technologies, interconnect methodologies, substrate materials and construction, metallization schemes, embedded and discrete passives, shielding and encapsulation techniques. Successful RF design requires not only an understanding of all of these, but also RF system and schematic knowledge, substrate design and characterization capabilities, and the skills to present and make engineering tradeoffs. Making the right choices can make or break the success of your product.

From RF Power Amplifiers to full 802.11 modems, AMSPL is committed to enabling our customers through our interactive RF Design and Applications Services. We help you optimize the cost, size and performance in your product choices and provide RF design services to improve your cycle time. Our RF design engineers know what our customers concerns are and how to achieve them. After all, our engineers have come from the ranks of RF and microwave product design organizations ranging from hybrid modules to handsets.

Radio System Intergration

• GSM / DCS / PCS / CDMA

• Bluetooth® / WLAN

• ISM Bands, Zigbee

• GPS, Satellite Radio